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होम उत्पादथर्मल आचरण पैड

Highly Efficient Thermal Conductivity 6.0 W/MK 100x100mm Silicone Thermal Pads For Laptop Heat Insulation Materials

चीन Dongguan Ziitek Electronic Materials & Technology Ltd. प्रमाणपत्र
चीन Dongguan Ziitek Electronic Materials & Technology Ltd. प्रमाणपत्र
थर्मल आचरणशील पैड देख रहा है और बहुत अच्छा काम कर रहा है। हमें अब अन्य थर्मल आचरण पैड की आवश्यकता नहीं है!

—— पीटर गोल्सबी

मैंने ज़ीटेक के साथ 2 वर्षों तक सहयोग किया था, उन्होंने उच्च गुणवत्ता वाले थर्मल प्रवाहकीय सामग्रियों और समय पर वितरण प्रदान किया था, उनके चरण परिवर्तन सामग्री की सिफारिश की थी

—— एंटोनेलो सॉ

अच्छी गुणवत्ता, अच्छी सेवा। आपकी टीम हमेशा हमें मदद और हल करने देती है, उम्मीद है कि हम हर समय अच्छे साथी बनेंगे!

—— क्रिस रोजर्स

मैं अब ऑनलाइन चैट कर रहा हूँ

Highly Efficient Thermal Conductivity 6.0 W/MK 100x100mm Silicone Thermal Pads For Laptop Heat Insulation Materials

Highly Efficient Thermal Conductivity 6.0 W/MK 100x100mm Silicone Thermal Pads For Laptop Heat Insulation Materials

बड़ी छवि :  Highly Efficient Thermal Conductivity 6.0 W/MK 100x100mm Silicone Thermal Pads For Laptop Heat Insulation Materials

उत्पाद विवरण:
उत्पत्ति के प्लेस: चीन
ब्रांड नाम: ZIITEK
प्रमाणन: UL and RoHs
मॉडल संख्या: TIF100-12-66U
भुगतान & नौवहन नियमों:
न्यूनतम आदेश मात्रा: 1000pcs
मूल्य: बातचीत योग्य
पैकेजिंग विवरण: 1000pcs/बैग
प्रसव के समय: 3-5work दिन
आपूर्ति की क्षमता: 10000/दिन
विस्तृत उत्पाद विवरण
प्रोडक्ट का नाम: लैपटॉप हीट इन्सुलेशन सामग्री के लिए अत्यधिक कुशल थर्मल चालकता 1.2W/MK 100x100 मिमी सिलिकॉन थर्मल पैड नमूना: नमूना मुक्त
कीवर्ड: सिलिकॉन थर्मल पैड फ्लेम रेटिंग: उल 94 वी -0
कॉन्टिनोस टेम्प का उपयोग करें: -45 से 200℃ कठोरता: 27 ± 5 किनारे 00
थर्मल चालकता (डब्ल्यू/एमके): 1.2W/mK पारद्युतिक स्थिरांक: 4.0 मेगाहर्ट्ज
निर्माण और खाद: सिरेमिक से भरा सिलिकॉन इलास्टोमर आवेदन: लैपटॉप गर्मी इन्सुलेशन सामग्री

Highly Efficient Thermal Conductivity 6.0 W/MK 100x100mm Silicone Thermal Pads For Laptop Heat Insulation Materials

 

The TIF®100-12-66U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features:


> Good thermal conductive :1.2W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses


Applications:


> Cooling components to the chassis of frame  
>  High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LCD TV and LED-lit lamps
> RDRAM memory modules 
> Micro heat pipe thermal solutions 
> Automotive engine control units
> Telecommunication hardware
> CPU
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes

 

Typical Properties of TIF®100-12-66U Series
Property Value Test method
Color Green Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Renforcement Carrier Polyimide film *******
Thickness range 0.010"(0.25mm)~0.200"(5.0mm) ASTM D374
Specific Gravity 2.1 g/cc ASTM D792
Hardness 27±5 Shore 00 ASTM 2240
Operating Temp -45 ~ 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant @1MHz 4.0MHz ASTM D150
Volume Resistivity ≥1.0X1012 Ohm-cm ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 1.2 W/m-K ASTM D5470


Product Thicknesses: 0.010"(0.25mm)~0.200"(5.0mm)

Product Sizes: 8" x 16"(203mm x 406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming
Safe disposal method does not require special protection.The storage condition is low temperature anddry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Highly Efficient Thermal Conductivity 6.0 W/MK 100x100mm Silicone Thermal Pads For Laptop Heat Insulation Materials 0
Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

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4. We will reply you as soon as possible with Email or online.

सम्पर्क करने का विवरण
Dongguan Ziitek Electronic Materials & Technology Ltd.

व्यक्ति से संपर्क करें: Dana Dai

दूरभाष: 18153789196

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