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होम उत्पादथर्मल आचरण पैड

Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Sheet Mat Interface Material Soft Thermal Pads

चीन Dongguan Ziitek Electronic Materials & Technology Ltd. प्रमाणपत्र
चीन Dongguan Ziitek Electronic Materials & Technology Ltd. प्रमाणपत्र
थर्मल आचरणशील पैड देख रहा है और बहुत अच्छा काम कर रहा है। हमें अब अन्य थर्मल आचरण पैड की आवश्यकता नहीं है!

—— पीटर गोल्सबी

मैंने ज़ीटेक के साथ 2 वर्षों तक सहयोग किया था, उन्होंने उच्च गुणवत्ता वाले थर्मल प्रवाहकीय सामग्रियों और समय पर वितरण प्रदान किया था, उनके चरण परिवर्तन सामग्री की सिफारिश की थी

—— एंटोनेलो सॉ

अच्छी गुणवत्ता, अच्छी सेवा। आपकी टीम हमेशा हमें मदद और हल करने देती है, उम्मीद है कि हम हर समय अच्छे साथी बनेंगे!

—— क्रिस रोजर्स

मैं अब ऑनलाइन चैट कर रहा हूँ

Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Sheet Mat Interface Material Soft Thermal Pads

Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Sheet Mat Interface Material Soft Thermal Pads

बड़ी छवि :  Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Sheet Mat Interface Material Soft Thermal Pads

उत्पाद विवरण:
उत्पत्ति के प्लेस: चीन
ब्रांड नाम: ZIITEK
प्रमाणन: UL and RoHs
मॉडल संख्या: TIF500-50-10U
भुगतान & नौवहन नियमों:
न्यूनतम आदेश मात्रा: 1000PCS
मूल्य: बातचीत योग्य
पैकेजिंग विवरण: 1000 पीसीएस/बैग
प्रसव के समय: 3-5work दिन
भुगतान शर्तें: टी/टी
आपूर्ति की क्षमता: 10000/दिन
विस्तृत उत्पाद विवरण
प्रोडक्ट का नाम: हीट डिसिपेशन गैप फिलर थर्मल कंडक्टिव सिलिकॉन पैड जीपीयू सीपीयू एलईडी थर्मल शीट मैट इंटरफ़ेस सामग्री कीवर्ड: थर्मली सिलिकॉन पैड
निर्माण एवं संरचना: सिरेमिक से भरा सिलिकॉन इलास्टोमेर ऊष्मीय चालकता: 5.0W/एम-के
कठोरता: 65 शोर 00 मोटाई रेंज: 0.25~5.0मिमी(0.010~0.20 इंच)
रंग: स्लेटी आवेदन: हीट डिसिपेशन जीपीयू सीपीयू एलईडी

Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Sheet Mat Interface Material Soft Thermal Pads


Company Profile


With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
 

Products description


TIF®500-50-10S Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:

 

> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> Available in varies thicknesses
> RoHS compliant
> UL recognized


Applications:

 

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

 

Typical Properties of TIF®500-50-10US Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 27 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

 

Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Sheet Mat Interface Material Soft Thermal Pads 0

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
 
Component Codes:
 
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
 

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Heat Dissipation Gap Filler Thermal Conductive Silicone Pad Gpu Cpu Led Thermal Sheet Mat Interface Material Soft Thermal Pads 1

FAQ:

 

Q: Are you trading company or manufacturer ? 

A: We are manufacturer in China.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

 

सम्पर्क करने का विवरण
Dongguan Ziitek Electronic Materials & Technology Ltd.

व्यक्ति से संपर्क करें: Dana Dai

दूरभाष: 18153789196

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